Realme is expected to unveil the X50 5G before January 25. The company hasn’t revealed the launch date yet, but it’s been drip-feeding us with information about its first 5G smartphone for the past few weeks.
Realme has already confirmed that the X50 5G will be powered by the Snapdragon 765G SoC and support simultaneous 5G and Wi-Fi connections. Today, Realme sheds some light on the X50 5G’s cooling system.
Realme says that X50 5G will come with a five-dimensional ice-cooled heat dissipation system and it will cover 100% area of heat sources. The cooling solution will also include an 8mm ultra-large liquid-cooled copper tube.
The X50 5G is also confirmed to sport a display with a punch hole in the top-left corner for the dual selfie camera. Realme hasn’t officially revealed any other details yet, but rumors have it that the X50 5G will come with a 6.6″ LCD (meaning no UD fingerprint reader), a 64MP quad camera setup, and 30W fast charging.
More information about the Realme X50 5G should surface in the coming days.
Source (in Chinese)
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