7 oct. 20192 MinSamsung 12-Layer 3D-TSV chip packing tech introducedSamsung isn’t just a leader in the mobile market. It’s also one of the top brands when it comes to semiconductors. Not many people...
7 oct. 20192 MinSamsung 12-Layer 3D-TSV chip packing tech introducedSamsung isn’t just a leader in the mobile market. It’s also one of the top brands when it comes to semiconductors. Not many people...
30 sept. 20192 MinKirin A1 announced as first Bluetooth 5.1, BLE 5.1 wearable chipThe world of wearables continues to thrive. We can’t say it’s significantly growing like when wearable devices first came out but there...
30 sept. 20192 MinKirin A1 announced as first Bluetooth 5.1, BLE 5.1 wearable chipThe world of wearables continues to thrive. We can’t say it’s significantly growing like when wearable devices first came out but there...